Electrical Insulation / Potting Systems

Copps Industries’ (500+) custom designed epoxy adhesive,potting and encapsulation materials are used in transformers, ballasts, ignition coils, and a variety of other applications.

One and two component, heat cure and ambient cure, high temperature potting and encapsulation systems are available.

At Copps we don’t just sell you a product, we provide you with a solution that improves your process and reduces your costs. Please contact a Copps Industries technical sales representative to discuss your application and receive a product recommendation or custom formulated product.

Adhesives

  • Surface Mount Device Adhesives
  • Automotive Assembly Adhesives
  • Motor Magnet Adhesives
  • Electrically Conductive Adhesives

Insulation Varnishes

  • VOC Free Electrical Motor Varnish
  • VPI (Vacuum Pressure Impregnation)
  • Ignition Coil Insulation
  • Dip and Trickle Impregnation of Stators and Armatures
A partial list of 1 and 2 part epoxy systems are below for your review.
Product Viscosity, @25C (cps) Pot life, 454g @ 22C min. Gel time, 454g @ 22C min. Mix Ratio, parts by vol Application Properties
A-014BK/
B-083		 1200 60 120 3-1 Long potlife and low viscosity,excellent thermal shock resistance
A-254BK/
B-456BK		 2300 40 60 1-1 Elastomer toughened, outstanding resiliency, convenient ratio
A-079BK/
B-404		 3000 60 150 6.3-1 High service temperature, UL 94VO flame retardant
A-103/
B-103		 600 43 45 4-1 Low viscosity, unfilled, low vapor pressure, excellent penetration
A-065/
B-065		 3000 20 35 1-1 Semi-flexible, excellent impact strength, low shore D hardness
Heat Cured, High Temperature Potting and Encapsulation Systems
Product Viscosity, @25C (cps) Pot life, 454g @ 22C, hrs. Gel time, 454g min. Mix Ratio, parts by vol Application Properties
A-036BK/
B-036		 15,500 36 30 @ 105C 1-1 UL 94VO Flame retardant, thermal shock resistant
A-211/
B-417		 1,100 10 45 @ 105C 2-1 Excellent thermal conductivity, extreme toughness
Multi Purpose Adhesive Systems:
Product Viscosity, @25C (cps) Pot life, 454g @ 22C min. Gel time, Film @22C min. Mix Ratio, parts by vol Substrate Materials Application Properties
A-007/
B-006		 soft paste 45 60 1-1 FRP, ceramic, various metals General purpose adhesive for non sag applications
A-018/
B-072		 7,000 30 120 1-1 metals, glass, ceramic, wood, FRP concrete Non critical mix ratio, variable flexibility
A-018/
B-094		 12,500 2 5 1-1 glass, FRP metals, ceramic, wood, concrete 5 minute gel, adhesive,
A-089WH/
B-089BK		 soft paste 20 180 1-1 glass, FRP urethane, metals, wood Toughened, shock resistant, resilient
Electrically Conductive Adhesives:
Product Viscosity, @25C (cps) Pot life, 454g @ 22C Gel time, Film @150C min. Mix Ratio, parts by vol Substrate Materials Application Properties
A-244BK/
B-472BK		 soft paste 8 hrs. 5 1.2-1 metals, glass, FRP Electrically conductive,300 ohms, heat resistant
Magnet Adhesives:
Product Viscosity, @25C (cps) Pot life, 454g @ 22C Gel time, Film min. Mix Ratio, parts by vol Substrate Materials Application Properties
A-274BK/
B-474		 soft paste 9 hrs. 45 @ 121C 3-1 Magnetic Tough, resilient, excellent adhesion
D-102 soft paste 3 months 12 @ 121C single component Magnetic Resilient, thermal shock resistant

Please contact a Copps Industries technical sales representative to discuss your application and receive a product recommendation or custom formulated product.

Electrical Insulation / Potting Systems